RIGID PCB CAPABILITIES
Fuchuangke Technology provides 1-20 layers quick-turn FR4 Printed Circuit Boards (PCBs) manufactured with top brand FR4 copper clad lamination materials to reach the highest quality at the reasonable pricing. Whether you need a few quick turn PCB prototypes or mass production as per IPC standards, ISO 9001:2015, ISO 14001:2015 and RoHS standards, our world class manufacturing can meet your specialized PCB needs.
The FR4 rigid PCB manufacturing capabilities below is designed to help you understand if our capabilities are a match for your PCB design, including standard and heavy copper PCB, and it will also allow you to plan ahead and create your PCB design within these capabilities so that you can be sure we can build your PCB board.
| Item | Standard |
| Layer Count |
1-20 Single-sided PCB Double-Sided PCB Thru-Hole Multilayer PCB Multilayer Blind & Buried PCB Heavy Copper Power PCB Semiconductor Test PCB |
| PCB type | |
| Finished Board Thickness |
HASL Lead free 0.6-4.0mm Flash gold 1.0-3.2mm Hard gold 0.1-5.0mm ENIG 0.2-7.0mm Flash gold(electroplated gold) 0.15-5.0mm Immersion Tin 0.4-5.0mm Immersion silver 0.4-5.0mm OSP 0.2-6.0mm |
| Hybrid laminating | Yes |
| Controlled Impedance Tolerance | +/-5%, +/-10% |
| Solder Mask Registration | +/-2mil |
| Solder Mask Min Dam Size | 0.15mm (6mil) |
| Min Diameter Rout Cutter Available | 0.6mm (24mil) |
| Thickness Tolerance | 10% (as per stack-up) |
| Build-up | Mechanical Blind & Buried Vias with Less than 3 times Laminating |
| Buried Vias | 2 or less |
| Blind Vias | Yes |
| Via-in-Pad | Yes |
| Conductive Filled Vias | Yes |
| Non-Conductive Filled Vias | Yes |
| Aspect Ratio | -10:1(HASL Lead free, ENIG, Immersion Tin, Immersion silver, ENEPIG);-8:1(OSP) |
| Min Trace Width/Spacing | |
| Inner Layers (1/2 oz) | 3mil/3mil |
| Inner Layers (1 oz) | 3mil/4mil |
| Inner Layers (2 oz) | 4mil/5.5mil |
| Inner Layers (3 oz) | 5mil/8mil |
| Inner Layers (4 oz) | 6mil/11mil |
| Inner Layers (5 oz) | 7mil/14mil |
| Inner Layers (6 oz) | 8mil/16mil |
| Inner Layers (7 oz) | 9mil/19mil |
| Inner Layers (8 oz) | 10mil/22mil |
| Inner Layers (9 oz) | 11mil/25mil |
| Inner Layers (10 oz) | 12mil/28mil |
| Outer Layers (1/2 oz) | 3.9mil/4.5mil |
| Outer Layers (1 oz) | 4.8mil/5.5mil |
| Outer Layers (2 oz) | 6mil/7mil |
| Outer Layers (3 oz) | 6mil/10mil |
| Outer Layers (4 oz) | 7.5mil/13mil |
| Outer Layers (5 oz) | 9mil/16mil |
| Outer Layers (6 oz) | 10mil/19mil |
| Outer Layers (7 oz) | 11mil/22mil |
| Outer Layers (8 oz) | 12mil/26mil |
| Outer Layers (9 oz) | 13mil/30mil |
| Outer Layers (10 oz) | 14mil/35mil |
| Surface Finish | |
| Flash Gold (Electroplated Gold) | Yes |
| ENIG | Yes |
| Hard Gold | Yes |
| Flash Gold | Yes |
| HASL Lead Free | Yes |
| ENEPIG | Yes |
| Soft Gold | Yes |
| Immersion Silver | Yes |
| Immersion Tin | Yes |
| ENIG +OSP | Yes |
| ENIG +Gold Finger | Yes |
| Flash Gold (Electroplated Gold)+Gold finger | Yes |
| Solder Mask | |
| Semi – Glossy | Yes |
| Glossy | Yes |
| Matte | Yes |
| Green | Yes |
| Black | Yes |
| Red | Yes |
| Blue | Yes |
| Yellow | Yes |
| White | Yes |
| Clear | Yes |
| Bright White | Yes |
| Purple | Yes |
| Silkscreen | |
| All colors | Yes |
| Other Process | |
| Routed Array | Yes |
| V-Cut, Edge to Copper | 0.25mm (9.8mil) |
| V-Cut Angle | 35°,45°,60° |
| Countersink | Yes |
| Counterbore | Yes |
| Beveling | Yes |
| Milling | +/-3mil |
| Edge Castellation | Yes |
| Edge Plating | Yes |
| Heatsinks | Yes |
Click above FR4 PCB Quote button to fill in your PCB specifications, upload your Gerber files, BOM, Assembly Drawing and Pick-and-Place file to get PCB cost or turnkey PCB assembly cost.
