Relied on our 8 SMT lines, and 4 PCBA testing and thru-hole assembly lines, Fuchuangke Technology provides our customers with reliable printed circuit board (PCB) assembly service that achieve quality results at competitive prices. As a leading turnkey PCB assembly house (company), we specialize in surface mount and thru-hole PCB assembly, configured to meet the design, specification and volume of your electronic hardware project. With multi-assembly setup, we can manufacture different products simultaneously and our conventional PCB assembly  capabilities enable us to manufacture single or double-sided, mixed technology PCBs.

With the commitment to be a professional and outstanding PCB assembly manufacturer and supplier Shenzhen China, we have invested heavily more than 80million RMB (about 1.2million USD) into the surface mount technology, inspection and testing equipment, technician and engineer. Our 8 SMT lines mainly equipped with machines from Fuji, Panasonic, Koh Young, ITW EAE, OMRON, Phoenix and Heller, which are top brands over the world in SMT placement technology , solder paste printing and inspection technology, X-ray technology and reflow temperature control technology, and we are capable of providing automated placement of micro-BGA parts, giving us the flexibility to accommodate your requirements for each project with quality guarantee without PCB board assembly defect.

Surface Mount Devices (SMDs) are attached to the same side of the printed circuit board as the solder pads, and these pads can be both sides of the PCB. Pin-Through-Hole Devices (PTH) are placed on the top side of the PCB, have their leads inserted through holes in the PCB, and are soldered from the bottom usually through a wave soldering process or soldering by hand. View our advanced PCB assembly manufacturing capabilities below, which covering rigid (FR4 & metal core)PCB assembly, printed flexible circuit (FPC) assembly and rigid-flex PCB assembly.

Item Description
Single and Double-Sided Assembly Yes
Smallest Chips Size 0201
Min BGA Pitch 11.8mil (0.3mm)
BGA Ball Counts >=1,000
Min Leaded Parts Pitch 1/3 oz
SMD Connectors Assembly Yes
Odd Form Parts Yes, Assembly by hands
LED
Resistor and capacitor networks
Electrolytic capacitors
Variable resistors and capacitors (pots)
Sockets
Leadless Parts Yes
BGA
µBGA
CABGA
CTBGA
CVBGA
LGA
VFBGA
CSP
Thru-hole (/ DIP) Parts Yes
Wiring & Cabling Yes
Electromechanical Yes
Standard PCB Assembly Yes
Multilayer PCB Assembly Yes
Flexible PCB Assembly Yes
Rigid-flex PCB Assembly Yes
HDI Rigid-flex PCB Assembly Yes
HDI PCB Assembly Yes
Aluminum PCB Assembly Yes
Min PCB Panel Size 48mm x 48mm (1.89”x1.89”) recommended
Max PCB Panel Size 250mm x 610mm (9.84”x24”) recommended
Fiducial Marks Preferred 3, but not required
PCB Surface Finished Not limited
PCB Shape Not limited
PCB Panelization Method Not limited
SPI (Solder Paste Inspection) Yes
Visual Inspection Yes
IC Programming Yes
AOI (Automated Optical Inspection) Yes
X-ray Inspection Yes
FAI (First Article Inspection) Yes
ICT (In-Circuit Inspection) Yes
FCT (Functional Inspection) Yes
X-ray Fluorescence Spectrometer Yes
PCBA Depanelization Yes, by machine or hand
Rework or Replacement Yes
BGA, LGA, VFBGA, CSP, ETC.
Odd Form Parts
Thru-hole Parts

PCB Assembly Facility with ISO9001:2015 certified

  • 32million x SMD components per day
  • 2million x PTH component per day
  • 4,000 square meters Dust-free assembly workshop
  • 8x SMT lines
  • 4x Thru-hole assembly & Testing lines
  • 320x employees including management, engineers and technicians
  • 2x shifts a day
  • 8x Momentum Speedline MPM Elite automated solder paste printer from USA
  • 8x KOH YOUNG KY-8030-2 Solder Paste Inspection machines from South Korea
  • 12x Panasonic NPM-D3 SMT assembly machines from Japan
  • 36x Fuji NXT III SMT assembly machines from Japan
  • 3x Panasonic NPM-TT2 SMT assembly machines from Japan
  • 8x Fuji XPF-L SMT assembly machines from Japan
  • 2x OMERON VT-RNS AOI machines from Japan
  • 5x Heller 1913 MK3 Reflow Oven from USA
  • 3x Heller 1936 MK5 Reflow Oven from USA
  • 1x Phoenix x|aminer X-ray from Germany
  • 1x X-ray Fluorescence Spectrometer
  • 1x SMT First Article Inspection machine
  • 1x BGA Rework Station
  • Support passive component packages including 01005, 0201, 0402 and etc.
  • Support leadless parts soldering including BGA, ?BGA, CABGA, CTBGA, CVBGA, LGA, VFPBGA, CSP, QFN and etc.
  • Support all kinds of leaded parts soldering
  • Support wiring, cabling and electromechanical assembly
  • Support SPI, AOI, X-Ray, IC Programming, ICT, FCT, FAI and RoHS compliance inspection
  • Support electronic assembly for applications of telecommunication, vehicle, medical, consumer electronics, etc.

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