Relied on our 8 SMT lines, and 4 PCBA testing and thru-hole assembly lines, Fuchuangke Technology provides our customers with reliable printed circuit board (PCB) assembly service that achieve quality results at competitive prices. As a leading turnkey PCB assembly house (company), we specialize in surface mount and thru-hole PCB assembly, configured to meet the design, specification and volume of your electronic hardware project. With multi-assembly setup, we can manufacture different products simultaneously and our conventional PCB assembly capabilities enable us to manufacture single or double-sided, mixed technology PCBs.
With the commitment to be a professional and outstanding PCB assembly manufacturer and supplier Shenzhen China, we have invested heavily more than 80million RMB (about 1.2million USD) into the surface mount technology, inspection and testing equipment, technician and engineer. Our 8 SMT lines mainly equipped with machines from Fuji, Panasonic, Koh Young, ITW EAE, OMRON, Phoenix and Heller, which are top brands over the world in SMT placement technology , solder paste printing and inspection technology, X-ray technology and reflow temperature control technology, and we are capable of providing automated placement of micro-BGA parts, giving us the flexibility to accommodate your requirements for each project with quality guarantee without PCB board assembly defect.
Surface Mount Devices (SMDs) are attached to the same side of the printed circuit board as the solder pads, and these pads can be both sides of the PCB. Pin-Through-Hole Devices (PTH) are placed on the top side of the PCB, have their leads inserted through holes in the PCB, and are soldered from the bottom usually through a wave soldering process or soldering by hand. View our advanced PCB assembly manufacturing capabilities below, which covering rigid (FR4 & metal core)PCB assembly, printed flexible circuit (FPC) assembly and rigid-flex PCB assembly.
Item | Description |
Single and Double-Sided Assembly | Yes |
Smallest Chips Size | 0201 |
Min BGA Pitch | 11.8mil (0.3mm) |
BGA Ball Counts | >=1,000 |
Min Leaded Parts Pitch | 1/3 oz |
SMD Connectors Assembly | Yes |
Odd Form Parts | Yes, Assembly by hands |
LED | |
Resistor and capacitor networks | |
Electrolytic capacitors | |
Variable resistors and capacitors (pots) | |
Sockets | |
Leadless Parts | Yes |
BGA | |
µBGA | |
CABGA | |
CTBGA | |
CVBGA | |
LGA | |
VFBGA | |
CSP | |
Thru-hole (/ DIP) Parts | Yes |
Wiring & Cabling | Yes |
Electromechanical | Yes |
Standard PCB Assembly | Yes |
Multilayer PCB Assembly | Yes |
Flexible PCB Assembly | Yes |
Rigid-flex PCB Assembly | Yes |
HDI Rigid-flex PCB Assembly | Yes |
HDI PCB Assembly | Yes |
Aluminum PCB Assembly | Yes |
Min PCB Panel Size | 48mm x 48mm (1.89”x1.89”) recommended |
Max PCB Panel Size | 250mm x 610mm (9.84”x24”) recommended |
Fiducial Marks | Preferred 3, but not required |
PCB Surface Finished | Not limited |
PCB Shape | Not limited |
PCB Panelization Method | Not limited |
SPI (Solder Paste Inspection) | Yes |
Visual Inspection | Yes |
IC Programming | Yes |
AOI (Automated Optical Inspection) | Yes |
X-ray Inspection | Yes |
FAI (First Article Inspection) | Yes |
ICT (In-Circuit Inspection) | Yes |
FCT (Functional Inspection) | Yes |
X-ray Fluorescence Spectrometer | Yes |
PCBA Depanelization | Yes, by machine or hand |
Rework or Replacement | Yes |
BGA, LGA, VFBGA, CSP, ETC. | |
Odd Form Parts | |
Thru-hole Parts |
PCB Assembly Facility with ISO9001:2015 certified
- 32million x SMD components per day
- 2million x PTH component per day
- 4,000 square meters Dust-free assembly workshop
- 8x SMT lines
- 4x Thru-hole assembly & Testing lines
- 320x employees including management, engineers and technicians
- 2x shifts a day
- 8x Momentum Speedline MPM Elite automated solder paste printer from USA
- 8x KOH YOUNG KY-8030-2 Solder Paste Inspection machines from South Korea
- 12x Panasonic NPM-D3 SMT assembly machines from Japan
- 36x Fuji NXT III SMT assembly machines from Japan
- 3x Panasonic NPM-TT2 SMT assembly machines from Japan
- 8x Fuji XPF-L SMT assembly machines from Japan
- 2x OMERON VT-RNS AOI machines from Japan
- 5x Heller 1913 MK3 Reflow Oven from USA
- 3x Heller 1936 MK5 Reflow Oven from USA
- 1x Phoenix x|aminer X-ray from Germany
- 1x X-ray Fluorescence Spectrometer
- 1x SMT First Article Inspection machine
- 1x BGA Rework Station
- Support passive component packages including 01005, 0201, 0402 and etc.
- Support leadless parts soldering including BGA, ?BGA, CABGA, CTBGA, CVBGA, LGA, VFPBGA, CSP, QFN and etc.
- Support all kinds of leaded parts soldering
- Support wiring, cabling and electromechanical assembly
- Support SPI, AOI, X-Ray, IC Programming, ICT, FCT, FAI and RoHS compliance inspection
- Support electronic assembly for applications of telecommunication, vehicle, medical, consumer electronics, etc.
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