SPI stands for Solder Paste Inspection in PCB assembly industry. SMT solder paste inspection is mainly done to check the solder paste deposits on the SMD component pads of bare printed circuit boards (PCBs) before SMT assembly. As a quick turnkey PCB assembly manufacturer, what all we do are to provide our customers the highest possible quality PCB assembly services, and make them having enough confidence in launching their products to the market without quality worries. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection process after solder paste printing, we can reduce or eliminate almost all solder joint defects to improve the SMT quality.
Features of Our Solder Paste Inspection (KY-8030-2)
-Maximum Board Size: 510mm x 510mm (20.08’’x20.08’’)
-Minimum Board Size: 50mm x 50mm (1.97’’x1.97’’)
-PCB Thickness: 0.4mm – 5.0mm (0.016’’ – 0.2’’)
-< 10% GR&R at 6µm
-Volume repeatability <1% at 3µm on KY calibration target
-Average volume repeatability <3% at 3µm on a PCB
-Detect all defects: insufficient & excessive deposits, shape deformation, missing paste, paste offset, smearing, bridging and more.
The Key benefits of solder paste inspection are mainly improving the PCB assembly quality, the production yield, printing quality and the performance of the PCBAs. The 2MP CCD camera is used in our SPI machine to take pictures, which are used for measuring the volume, square, height, location, shape and alignment of the solder paste. Through the SPC statistical analysis, we can defect all solder paste problems, then solve them before SMD component assembly.
As a Turn-key PCB Assembly Supplier, for ensuring all PCBs assembled by us are without defects before shipping out from the PCB assembly facility, except for solder paste inspection, Fuchuangke Technology also provides a variety of inspection and testing methods, including Manual Visual Inspection, AOI (Automated Optical Inspection), X-ray Inspection, FCT (Functional Circuit Testing), and ICT (In-Circuit Testing). These inspection methods such as these help us to guarantee quality for all types of modern PCB projects in full turnkey orders. Our SPI process can cover all types of PCB assembly orders, including prototype PCB assembly, Low-volume PCB assembly and high-volume PCB assembly, especially for complex PCB designs.
All mentioned above of SPI process is to ensure to provide high quality PCB assemblies to customers. The inspection process not only helps manufacture defect-free PCBAs, but also saves significant costs. In addition to this, it also helps reduce the turnaround time. This explains the worth of solder paste inspection process. We conduct SPI inspection on prototype, low-volume, mid-volume and high-volume PCB assembly projects.
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For more information about solder paste inspection on your newest PCB assembly orders, feel free to Contact Us.