IPC Standards in Electronic Industry
IPC, stands for Association Connecting Electronics Industries, and it is the abbreviation of its initial name “Institute of Printed Circuits” in the fall of 1957. IPC is the only trade association that brings together all of the players in this industry: designer, PCB manufacturers, assembly companies, suppliers, and original equipment manufacturers. IPC has been dedicated to removing supply chain obstacles, creating industry standards, and supporting the advancement of the electronics industry, including printed circuit board manufacturing and assembly field.
IPC Standards Tree
IPC Terminology
For helping the users to understand and work with IPC standards, IPC provides definitions of terms it uses. The common terminology can also make communication more accurate and efficient across the industry. You can purchase a full list of names and definitions from IPC, but there are a few examples of the kinds of terms you may want to know.
Three Classes of Electronic Products
- Class 1 – general electronic products: Class one products are for applications in which the primary requirement is the function of the completed assembly. This class includes most typical everyday products.
- Class 2 – dedicated service electronic products: Class two products must have high reliability and extended life. Uninterrupted service is preferable, but not critical. The use environment of the product typically wouldn’t cause failures.
- Class 3 – high-performance electronic products: Class three products must provide continued performance or performance on demand. There can be no equipment downtime, and the end-use environment may be exceptionally harsh. The equipment must function when required. This category includes critical systems such as life support systems.
Here are some other terms you may want to know.
- Acceptance tests: The tests required to determine whether a product is acceptable, as agreed upon by the purchaser and vendor.
- Assembly: Several parts, subassemblies or combinations thereof joined together.
- Resist: A coating material used to mask or protect certain areas of a pattern during manufacturing or testing from the action of an etchant, plating, solder, etc.
- Integrated circuit: A combination of inseparable associated circuit elements formed in place and interconnected on or within a single base material to perform a microcircuit function.
- Flexural strength: The tensile strength of the outermost fiber of a material that must bend.
- Critical operation: One procedure of a total process that has a significant impact on the characteristics of the completed product.
IPC Standards and Document Name
| IPC Standard | Standard Document Name |
| J-STD-001 | Requirements for Soldered Electrical and Electronic Assemblies |
| J-STD-001xSSpace Hardware Addendum | Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001D |
| IPC-HDBK-001 | Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies |
| SMC-TR-001 | An Introduction to Tape Automated Bonding Fine Pitch Technology |
| IT-WP-001 | Myths of E-Commerce |
| SMC-WP-001 | Soldering Capability White Paper Report |
| SMEMA 1.2 | Mechanical Equipment Interface Standard |
| JP002 | Current Tin Whiskers Theory and Mitigation Practices Guideline |
| J-STD-002 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
| SMC-WP-002 | An Assessment of the Use of Lead in Electronic Assembly |
| J-STD-003 | Solderability Tests for Printed Boards |
| SMC-WP-003 | Chip Mounting Technology |
| SMEMA 3.1 | Fiducial Mark Standard |
| J-STD-004 | Requirements for Soldering Fluxes |
| SMC-WP-004 | Design for Success |
| SMEMA 4 | Reflow Terms and Definitions |
| J-STD-005 | Requirements for Soldering Pastes |
| SMC-WP-005 | PWB Surface Finishes |
| IPC-HDBK-005 | Guide to Solder Paste Assessment |
| SMEMA 5 | Screen Printing Terms and Definitions |
| J-STD-006 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
| SMEMA 6 | Electronics Cleaning Terms and Definitions |
| SMEMA 7 | Fluid Dispensing Terms and Definitions |
| IPC-WP-008 | Setting up Ion Chromatography Capability |
| J-STD-012 | Implementation of Flip Chip and Chip Scale Technology |
| J-STD-013 | Implementation of Ball Grid Array and Other High Density Technology |
| IPC-DRM-18 | Component Identification Desk Reference Manual |
| J-STD-020 | Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
| J-STD-026 | Semiconductor Design Standard for Flip Chip Applications |
| J-STD-027 | Mechanical Outline Standard for Flip Chip or Chip Scale Configurations |
| J-STD-028 | Performance Standard for Flip Chip Scale Bumps |
| J-STD-030 | Selection and Application of Board Level Underfill Materials |
| J-STD-032 | Performance Standard for Ball Grid Array Bumps and Columns |
| J-STD-033 | Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices |
| J-STD-035 | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components |
| IPC-0040 | Optoelectronic Assembly and Packaging Technology |
| J-STD-046 | Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers |
| (Joint JEDEC/IPC/ECIA) | |
| J-STD-048 | Notification Standard for Product Discontinuance |
| IPC-T-50 | Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
| IPC-DRM-53 | Introduction to Electronics Assembly |
| IPC-SC-60 | Post Solder Solvent Cleaning Handbook |
| IPC-SA-61 | Post-Solder Semi-Aqueous Cleaning Handbook |
| IPC-AC-62 | Post Solder Aqueous Cleaning Handbook |
| IPC-CH-65 | Guidelines for Cleaning of Printed Boards and Assemblies |
| IPC-CS-70 | Guidelines for Chemical Handling Safety in Printed Board Manufacturing |
| J-STD-075 | Classification of Non-IC Electronic Components for Assembly Processes |
| IPC-CM-78 | Guidelines for Surface Mounting and Interconnecting Chip Carriers |
| IPC-MP-83 | IPC Policy on Metrication |
| IPC-PC-90 | General Requirements for Implementation of Statistical Process Control |
| IPC-QS-95 | General Requirements for Implementation of ISO 9000 Quality Systems |
| IPC-L-108 | Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |
| IPC-L-109 | Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards |
| IPC-L-110 | Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards |
| IPC-CC-110 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
| IPC-L-112 | Specification for Composite Metal Clad Base Materials for Printed Boards |
| IPC-L-115 | Specification for Rigid Metal Clad Base Materials for Printed Boards |
| IPC-L-120 | Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates |
| IPC-L-125 | Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
| IPC-L-130 | Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards |
| IPC-DD-135 | Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules |
| IPC-EG-140 | Specification for Finished Fabric Woven from “E” Glass for Printed Boards |
| IPC-SG-141 | Specification for Finished Fabric Woven from “S” Glass for Printed Boards |
| IPC-A-142 | Specification for Finished Fabric Woven from Aramid for Printed Boards |
| IPC-QF-143 | General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards |
| IPC-CF-148 | Resin Coated Metal for Printed Boards |
| IPC-MF-150 | Metal Foil for Printed Wiring Applications |
| IPC-CF-152 | Composite Metallic Material Specification for Printed Wiring Boards |
| IPC-FC-203 | Specification for Flat Cable, Round Conductor, Ground Plane |
| IPC-FC-210 | Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) |
| IPC-FC-213 | Performance Specification for Flat Undercarpet Telephone Cable |
| IPC-FC-217 | General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable |
| IPC-FC-218B/EIA-RS-429 | General Specification for Connectors, Electrical Flat Cable Type |
| IPC-FC-219 | Environment Sealed Flat Cable Connectors for use in Aerospace Applications |
| IPC-FC-220 | Specification for Flat Cable, Flat Conductor, Unshielded |
| IPC-FC-221 | Specification for Flat-Copper Conductors for Flat Cables |
| IPC-FC-222 | Specification of Flat Cable Round Conductor, Unshielded |
| IPC-FC-225 | Flat Cable Design Guide |
| IPC-FC-231 | Flexible Base Dielectrics for Use in Flexible Printed Wiring |
| IPC-FC-232 | Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films |
| IPC-FC-233 | Flexible Adhesive Bonding Films |
| IPC-FC-234 | PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits |
| IPC-FC-240 | Single sided flex |
| IPC-FC-241 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring |
| IPC-RF-245 | Performance Specification for Rigid-Flex Printed Boards |
| IPC-D-249 | Design Standard for Flexible Single-and Double-Sided Printed Boards |
| IPC-FC-250 | Specification for Single – and Double-Sided Flexible Printed Wiring |
| IPC-FA-251 | Guidelines for Single and Double Sided Flex Circuits |
| IPC-D-275 | Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
| IPC-RB-276 | Qualification and Performance Specification for Rigid Printed Boards |
| IPC-D-279 | Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies |
| IPC-D-300 | Printed Board Dimensions and Tolerances |
| IPC-D-310 | Guidelines for Phototool Generation and Measurement Techniques |
| IPC-A-311 | Process Control Guidelines for Phototool Generation and Use |
| IPC-D-316 | Design Guide for Microwave Circuit Boards Utilizing Soft Substrates |
| IPC-D-317 | Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques |
| IPC-HF-318 | Microwave End Product Board Inspection and Test |
| IPC-D-319 | Design Standard for Rigid Single-and Double-Sided Printed Boards |
| IPC-SD-320 | Performance Specification for Rigid Single- and Double-Sided Printed Boards |
| IPC-D-322 | Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes |
| IPC-MC-324 | Performance Specifications for Metal Core Boards |
| IPC-D-325 | Documentation Requirements for Printed Boards, Assemblies and Support Drawings |
| IPC-D-326 | Information Requirements for Manufacturing Printed Board Assemblies |
| IPC-D-330 | Design Guide Manual |
| IPC-PD-335 | Electronic Packaging Handbook |
| IPC-NC-349 | Computer Numerical Control Formatting for Drillers and Routers |
| IPC-D-350 | Printed Board Description in Digital Form |
| IPC-D-351 | Printed Board Drawings in Digital Form |
| IPC-D-352 | Electronic Design Data Description for Printed Boards in Digital Form |
| IPC-D-354 | Library Format Description for Printed Boards in Digital Form |
| IPC-D-355 | Printed Board Assembly Description in Digital Form |
| IPC-D-356 | Bare Board Electrical Test Information in Digital Form |
| IPC-AM-361 | Specification for Rigid Substrates for Additive Process Printed Boards |
| IPC-MB-380 | Guidelines for Molded Interconnection Devices |
| IPC-D-390 | Automated Design Guidelines |
| IPC-C-406 | Design and Application Guidelines for Surface Mount Connectors |
| IPC-CI-408 | Solderless Surface Mount Connector Design Characteristics and Application Guidelines |
| IPC-BP-421 | General Specification for Rigid Printed Board Backplanes with Press Fit Contacts |
| IPC-D-422 | Design Guide for Press Fit Rigid Printed Board Backplanes |
| IPC-DW-424 | General Specification for Encapsulated Discrete Wire Interconnection Boards |
| IPC-DW-425 | Design and End Product Requirements for Discrete Wiring Boards |
| IPC-DW-426 | Specifications for Assembly of Discrete Wiring |
| IPC-TR-460 | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards |
| IPC-TR-461 | Solderability Evaluation of Thick and Thin Fused Coatings |
| IPC-TR-462 | Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage |
| IPC-TR-464 | Accelerated Aging for Solderability Evaluations |
| IPC-TR-465-1 | Round Robin Test on Steam Ager Temperature Control Stability |
| IPC-TR-465-2 | The Effect of Steam Aging Time and Temperature on Solderability Test Results |
| IPC-TR-465-3 | Evaluation of Steam Aging on Alternative Finishes, Phase IIA |
| IPC-TR-466 | Wetting Balance Standard Weight Comparison Test |
| IPC-TR-467 | Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D |
| IPC-TR-468 | Factors Affecting Insulation Resistance Performance of Printed Boards |
| IPC-TR-470 | Thermal Characteristics of Multilayer Interconnection Boards |
| IPC-TR-474 | An Overview of Discrete Wiring Techniques |
| IPC-TR-476 | How to Avoid Metallic Growth Problems on Electronic Hardware Rev A Electrochemical Migration Electrically Induced Failures In Printed Assemblies |
| IPC-TR-480 | Results of Multilayer Test Program Round Robin IV Phase I |
| IPC-TR-481 | Results of Multilayer Test Program Round Robin V |
| IPC-TR-482 | New Developments in Thin Copper Foils |
| IPC-TR-483 | Dimensional Stability Testing of Thin Laminates – Report on Phase I International Round Robin Test Program |
| IPC-TR-484 | Results of IPC Copper Foil Ductility Round Robin Study |
| IPC-TR-485 | Results of Copper Foil Rupture Strength Test Round Robin Study |
| IPC-TR-486 | Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations |
| IPC-TR-549 | Measles in Printed Wiring Boards |
| IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components |
| IPC-DR-570 | General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards |
| IPC-DR-572 | Drilling Guidelines for Printed Boards |
| IPC-TR-575 | Additive Process Evaluation-Report on Phase I IPC Round Robin Testing Program on Additive Printed Wiring Boards |
| IPC-TR-576 | Additive Process Evaluation |
| IPC-TR-577 | Additive Process Evaluation – Report on Phase III IPC Round Robin Testing Program on Rigid Additive Printed Boards |
| IPC-TR-578 | Leading Edge Manufacturing Technology Report – Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards |
| IPC-TR-579 | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards |
| IPC-TR-580 | Cleaning and Cleanliness Test Program Phase 1 Test Results |
| IPC-TR-581 | IPC Phase 3 Controlled Atmosphere Soldering Study |
| IPC-TR-582 | IPC Phase 3 No-Clean Flux Study |
| IPC-TR-583 | An In-Depth Look At Ionic Cleanliness Testing |
| IPC-WP/TR-584 | IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies |
| IPC-TR-585 | Time, Temperature and Humidity Stress of Final Board Finish Solderability |
| IPC-TR-586 | Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) |
| IPC-A-600 | Acceptability of Printed Boards |
| IPC-SS-605 | Printed Board Quality Evaluation Slide Set |
| IPC-QE-605 | Printed Board Quality Evaluation Handbook |
| J-STD-609 | Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices |
| IPC-A-610 | Acceptability of Electronic Assemblies |
| IPC-A-610xC | IPC-A-610xC Telecom Addendum |
| IPC-HDBK-610 | Handbook and Guide to IPC-A-610 (Includes B-C-D comparison) |
| IPC-QE-615 | Assembly Quality Evaluation Handbook |
| IPC-D-620 | Design and Critical Process Requirements for Cable and Wiring Harnesses |
| IPC/WHMA-A-620 REDLINE | Acceptability of Electronic Wire Harnesses and Cables |
| IPC/WHMA-A-620 | Acceptability of Electronic Wire Harnesses and Cables |
| IPC-HDBK-620 | Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620 |
| IPC/WHMA-A-620x-SSpace Hardware Addendum | Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620A-S with 620A, 620B-S with 620B, 620C-S with 620C |
| IPC-A-630 | Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures |
| IPC-HDBK-630 | Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures |
| IPC-AI-640 | User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates |
| IPC-A-640 | Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies |
| IPC-D-640 | Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies |
| IPC-AI-641 | User’s Guidelines for Automated Solder Joint Inspection |
| IPC-AI-642 | User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s |
| IPC-OI-645 | Standard for Visual Optical Inspection Aids |
| IPC-TM-650 | Test Methods Manual |
| IPC-ET-652 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
| IPC-QL-653 | Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material |
| IPC-MI-660 | Incoming Inspection of Raw Materials Manual |
| IPC-R-700 | Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies |
| IPC-TA-720 | Technology Assessment Handbook on Laminates |
| IPC-TA-721 | Technology Assessment Handbook on Multilayer Boards |
| IPC-TA-722 | Technology Assessment of Soldering |
| IPC-TA-723 | Technology Assessment Handbook on Surface Mounting |
| IPC-TA-724 | Technology Assessment Series on Cleanrooms |
| IPC-PE-740 | Troubleshooting Guide for Printed Board Manufacture and Assembly |
| IPC-CM-770 | Guidelines for Printed Board Component Mounting |
| IPC-SM-780 | Component Packaging and Interconnecting with Emphasis on Surface Mounting |
| IPC-SM-782 | Surface Mount Design and Land Pattern Standard |
| IPC-SM-784 | Guidelines for Chip-on-Board Technology Implementation |
| IPC-SM-785 | Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments |
| IPC-SM-786 | Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs |
| IPC-MC-790 | Guidelines for Multichip Module Technology Utilization |
| IPC-S-801 | |
| IPC-S-803 | |
| IPC-S-804 | Solderability Test Methods for Printed Wiring Boards |
| IPC-S-805 | Solderability Tests for Component Leads and Terminations |
| IPC-MS-810 | Guidelines for High Volume Microsection |
| IPC-S-815 | General Requirements for Soldering Electronic Interconnections |
| IPC-S-816 | SMT Process Guideline and Checklist |
| IPC-SM-817 | General Requirements for Dielectric Surface Mounting Adhesives |
| IPC-SF-818 | General Requirement for Electronic Soldering Fluxes |
| IPC-SP-819 | General Requirements and Test Methods for Electronic Grade Solder Paste |
| IPC-AJ-820 | Assembly and Joining Handbook |
| IPC-CA-821 | General Requirements for Thermally Conductive Adhesives |
| IPC-CC-830 | Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies |
| IPC-HDBK-830 | Guidelines for Design, Selection and Application of Conformal Coatings |
| IPC-SM-839 | Pre and Post Solder Mask Application Cleaning Guidelines |
| IPC-SM-840 | Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials |
| IPC-HDBK-840 | Solder Mask Handbook |
| IPC-HDBK-850 | Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly |
| IPC-H-855 | Hybrid Microcircuit Design Guide |
| IPC-D-859 | Design Standard for Thick Film Multilayer Hybrid Circuits |
| IPC-HM-860 | Specification for Multilayer Hybrid Circuits |
| IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Boards |
| IPC-ML-910 | Design and End Production Specification for Rigid Multilayer Printed Boards |
| IPC-D-949 | Design Standard for Rigid Multilayer Printed Boards |
| IPC-ML-950 | Performance Specification for Rigid Multilayer Printed Boards |
| IPC-ML-960 | Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards |
| IPC-ML-975 | End Product Documentation Specification for Multilayer Printed Wiring Boards |
| IPC-ML-990 | Performance Specification for Flexible Multilayer Wiring |
| IPC-TP-1043 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 |
| IPC-TP-1044 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 |
| IPC-1065 | Material Declaration Handbook |
| IPC-1066 | Labeling of PCBs and Assemblies |
| IPC-1071 | Intellectual Property Protection in Printed Board Manufacturing |
| IPC-1072 | Intellectual Property Protection in Assembly Manufacturing |
| IPC-1081 | White Paper on Conflict Minerals Due Diligence Cuidance |
| IPC-TP-1090 | The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002 |
| IPC-TP-1103 | Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads |
| IPC-TP-1114 | The Layman’s Guide to Qualifying a Process to J-STD-001B |
| IPC-TP-1115 | Selection and Implementation Strategy for A Low-Residue No-Clean Process |
| IPC-1131 | IT Guidelines for PWB Manufacturers |
| IPC-1331 | Voluntary Safety Standard for Electrically Heated Process Equipment |
| IPC-1401 | Corporate Social Responsibility |
| IPC-1601 | Printed Board Handling and Storage Guidelines |
| IPC-1710 | OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP) |
| IPC-1720 | Assembly Qualification Profile (AQP) |
| IPC-1730 | Laminator Qualification Profile (LQP) |
| IPC-1731 | Strategic Raw Materials Supplier Qualification Profile |
| IPC-1751 | Generic Requirements for Declaration Process Management |
| IPC-1752 | Materials Declaration Management |
| IPC-1753 | Laboratory Report Standard |
| IPC-1754 | Materials Declaration Standard for Aerospace and Defense |
| IPC-1755 | Conflict Minerals Data Exchange Standard |
| IPC-1756 | Manufacturing Process Data Management |
| IPC-1758 | Declaration Requirements for Shipping, Pack and Packing Materials |
| IPC-1782 | Standard for Manufacturing and Supply Chain Traceability of Electronic Products |
| IPC-1791 | Trusted Electronic Designer, Manufacturer, and Assembler Requirements |
| IPC-2141 | Controlled Impedance Circuit Boards and High Speed Logic Design |
| IPC-2152 | Standard for Determining Current Carrying Capacity in Printed Board Design |
| IPC-2221 | Generic Standard on Printed Board Design |
| IPC-2222 | Sectional Design Standard for Rigid Organic Printed Boards |
| IPC-2223 | Sectional Design Standard for Flexible Printed Boards |
| IPC-2224 | Sectional Standard for Design of PWBs for PC Cards |
| IPC-2225 | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
| IPC-2226 | Sectional Design Standard for High Density Interconnect (HDI) Printed Boards |
| IPC-2231 | DFX Guidelines |
| IPC-2251 | Design Guide for the Packaging of High Speed Electronic Circuits |
| IPC-2252 | Design and Manufacturing Guide for RF/Microwave Circuit Boards |
| IPC/JPCA-2291 | Design Guideline for Printed Electronics |
| IPC-2292 | Design Standard for Printed Electronics on Flexible Substrates |
| IPC/JPCA-2315 | Design Guide for High Density Interconnects (HDI) and Microvia |
| IPC-2316 | Design Guide for Embedded Passive Device Printed Boards |
| IPC-2501 | Definition for Web-based Exchange of XML Data |
| IPC-2511 | Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology |
| IPC-2512 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
| IPC-2513 | Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description |
| IPC-2514 | Sectional Requirements for Implementation of Printed Board Manufacturing Data Description |
| IPC-2515 | Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description |
| IPC-2516 | Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description |
| IPC-2517 | Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description |
| IPC-2518 | Sectional Requirements for Implementation of Part List Product Data Description |
| IPC-2524 | PWB Fabrication Data Quality Rating System |
| IPC-2531 | Standard Recipe File Format Specification |
| IPC-2541 | Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication |
| IPC-2546 | Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication |
| IPC-2547 | Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication |
| IPC-2571 | Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) |
| IPC-2576 | Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX) |
| IPC-2578 | Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) |
| IPC-2581 | Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) |
| IPC-2582 | Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description |
| IPC-2583 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
| IPC-2584 | Sectional Requirements for Implementation of Printed Board Fabrication Data Description |
| IPC-2588 | Sectional Requirements for Implementation of Part List Product Data Description |
| IPC-2591 | Connected Factory Exchange (CFX) |
| IPC-2611 | Generic Requirements for Electronic Product Documentation |
| IPC-2612 | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) |
| IPC-2612-1 | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology |
| IPC-2614 | Sectional Requirements for Board Fabrication Documentation |
| IPC-2615 | Printed Board Dimensions and Tolerances |
| IPC/PERM-2901 | Pb-free Design & Assembly Implementation Guide |
| IPC-3406 | Guidelines for Electrically Conductive Surface Mount Adhesives |
| IPC-3408 | General Requirements for Anistropically Conductive Adhesive Films |
| IPC-4101 | Specification for Base Materials for Rigid and Multilayer Printed Boards |
| IPC-4103 | Specification for Base Materials for High Speed/ High Frequency Applications |
| IPC/JPCA-4104 | Specification for High Density Interconnect (HDI) and Microvia Materials |
| IPC-4110 | Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards |
| IPC-4121 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
| IPC-4130 | Specification and Characterization Methods for Nonwoven “E” Glass Mat |
| IPC-4202 | Flexible Base Dielectrics for Use in Flexible Printed Wiring |
| IPC-4203 | Adhesive Coated Dielectric Films for Use as Cover Sheets |
| IPC-4204 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards |
| IPC-4411 | Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement |
| IPC-4412 | Specification for Finished Fabric Woven form “E” Glass for Printed Boards |
| IPC-4552 | Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards |
| IPC-4553 | Specification for Immersion Silver Plating for Printed Boards |
| IPC-4554 | Specification for Immersion Tin Plating for Printed Boards |
| IPC-4556 | Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards |
| IPC-4562 | Metal Foil for rinted Wiring Applications |
| IPC-4563 | Resin Coated Copper Foil for Printed Boards Guideline |
| IPC/JPCA-4591 | Requirements for Printed Electronics Functional Conductive Materials |
| IPC-HDBK-4691 | Handbook on Adhesive Bonding in Electronic Assembly Operations |
| IPC-4761 | Design Guide for Protection of Printed Board Via Structures |
| IPC-4781 | Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks |
| IPC-4811 | Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards |
| IPC-4821 | Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards |
| IPC-4921 | Requirements for Printed Electronics Base Materials |
| IPC-5701 | Users Guide for Cleanliness of Unpopulated Printed Boards |
| IPC-5702 | Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards |
| IPC-5703 | Cleanliness Guidelines for Printed Board Fabricators |
| IPC-5704 | Cleanliness Requirements for Unpopulated Printed Boards |
| IPC-6011 | Generic Performance Specification for Printed Boards |
| IPC-6012 | Qualification and Performance Specification for Rigid Printed Boards |
| IPC-6012C-TC | Test Coupon Addendum to IPC-6012C Qualification and Performance Specification for Rigid Printed Boards |
| IPC-6012DA | Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards |
| IPC-6012xA | Automotive Applications Addendum to IPC-6012. The addendum MUST be used with the same version of the standard, e.g., 6012DA with 6012D |
| IPC-6012xS | Space Applications Addendum to IPC-6012. The addendum MUST be used with the same version of the standard, e.g., 6012DS with 6012D |
| IPC-6013 | Qualification and Performance Specification for Flexible Printed Boards |
| IPC-6015 | Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
| IPC-6016 | Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards |
| IPC-6017 | Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices |
| IPC-6018 | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards |
| IPC-6018xS | Space and Military Avionics Applications Addendum to IPC-6018. The addendum MUST be used with the same version of the standard, e.g., 6018CS with 6012C. |
| IPC/JPCA-6202 | Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards |
| IPC/JPCA-6801 | Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection |
| IPC/JPCA-6901 | Application Categories for Printed Electronics |
| IPC-6903 | Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) |
| IPC-7091 | Design and Assembly Process Implementation of 3D Components |
| IPC-7092 | Design and Assembly Process Implementation for Embedded Components |
| IPC-7093 | Design and Assembly Process Implementation for Bottom Termination SMT Components |
| IPC-7094 | Design and Assembly Process Implementation for Flip Chip and Die Size Components |
| IPC-7095 | Design and Assembly Process Implementation for BGAs |
| IPC-7351 | Generic Requirements for Surface Mount Design and Land Pattern Standard |
| IPC-7525 | Guidelines for Stencil Design |
| IPC-7526 | Stencil and Misprinted Board Cleaning Handbook |
| IPC-7527 | Requirements for Solder Paste Printing |
| IPC-7530 | Guidelines for Temperature Profiling for Mass Soldering Processes (Wave and Reflow) |
| IPC-7535 | Solder Dross Reduction in Wave Soldering Process |
| IPC-7621 | Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics |
| IPC-7711/21 | Rework, Modification and Repair of Electronic Assemblies |
| IPC-7801 | Reflow Oven Process Control Standard |
| IPC-7912 | Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies |
| IPC-8413-1 | Specification for Manufacturing Process Carriers for Handling Optical Fiber |
| IPC-8497-1 | Cleaning Methods and Contamination Assessment for Optical Assembly |
| IPC-8701 | Final Acceptance Criteria Standard for PV Modules-Final Module Assembly |
| IPC-9111 | Troubleshooting for Printed Board Assembly Processes |
| IPC-9121 | Troubleshooting for Printed Board Fabrication Processes |
| IPC-9151 | Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database |
| IPC-9191 | General Guideline for implementation of Statistical Process Control (SPC) |
| IPC-9194 | Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline |
| IPC-9199 | SPC Quality Rating |
| IPC-9201 | Surface Insulation Resistance Handbook |
| IPC-9202 | Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance |
| IPC-9203 | Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle |
| IPC-9241 | Guidelines for Microsection Preparation |
| IPC-9251 | Test Vehicles for Evaluating Fine Line Capability |
| IPC-9252 | Requirements for Electrical Testing of Unpopulated Printed Boards |
| IPC-9261 | In-Process DPMO and Estimated Yield for PWAs |
| IPC-9262 | Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment |
| IPC/JEDEC-9301 | Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability |
| IPC-9501 | PWB Assembly Process Simulation for Evaluation of Electronic Components |
| IPC-9502 | PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components |
| IPC-9503 | Moisture Sensitivity Classification for Non-IC Components |
| IPC-9504 | Assembly Process Simulation for Evaluation of Non-IC Components |
| IPC-9505 | Guideline Methodology for Assessing Component and Cleaning Materials Compatibility |
| IPC-9591 | Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices |
| IPC-9592 | Requirements for Power Conversion Devices for the Computer and Telecommunications Industries |
| IPC-9631 | User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation |
| IPC-9641 | High Temperature Printed Board Flatness Guideline |
| IPC-9691 | User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
| IPC-9701 | Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments |
| IPC/JEDEC-9702 | Monotonic Bend Characterization of Board-Level Interconnects |
| IPC/JEDEC-9703 | Mechanical Shock Test Guidelines for Solder Joint Reliability |
| IPC/JEDEC-9704 | Printed Wiring Board Strain Gage Test Guideline |
| IPC/JEDEC-9706 | Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection |
| IPC/JEDEC-9707 | Spherical Bend Test Method for Characterization of Board Level Interconnects |
| IPC-9708 | Test Methods for Characterization of Printed Board Assembly Pad Cratering |
| IPC-9709 | Test Guidelines for Acoustic Emission Measurement during Mechanical Test |
| IPC-9850 | Surface Mount Equipment Performance Characterization |
| IPC-SMEMA-9851 | Equipment Interface Specification |
| IPC-HERMES-9852 | The Global Standard for Machine-to-Machine Communication in SMT Assembly |
| IPC-DRM-PTH(IPC-DRM-40) | Through-Hole Solder Joint Evaluation Desk Reference Manual |
| IPC-DRM-SMT | Surface Mount Solder Joint Evaluation Desk Reference Manual |
| IPC-DRM-WHA(IPC-DRM-56) | Wire Preparation & Crimping |
| IPC-EMSI-TC | IPC Sample Master Ordering Agreement for EMS Companies and OEMs |
RELATED POSTS
Long Flexible Printed Circuit Fabrication
BLOG HOME BLOG FLEXIBLE PCB LONG FLEXIBLE PRINTED CIRCUIT FABRICATION Long Flexible Printed Circuit Fabrication Solder Paste Printing, Placement, and ...
Quick-turn Flexible PCB Manufacturer
BLOG HOME BLOG FLEXIBLE PCB QUICK-TURN FLEXIBLE PCB MANUFACTURER Quick-turn Flexible PCB Manufacturer Quick-turn Flexible PCB ManufacturerWe are an ISO9001:2015 ...
