The process by which imaging material (resist) is chemically removed from a panel during PCB fabrication.

The steps to image-develop-etching-stripping (ES) are:
1.Apply dry film that is photo imageable to the copper panels.
2.Image the panels using laser direct imaging.
3.Develop the dry film. All areas exposed by the laser will remain while the unexpected areas will develop off. The remaining film will act as etch barrier to prevent the conductive pattern from being etched, while exposing any unwanted copper (this is for inner layers.)
4.Etching off the exposed copper from the panel.
5.Stripping the remaining dry film so the final conductive copper pattern is left for the inner layers.