Coated Copper Materials are comprised of copper foil, coated with a dielectric material that can be directly bonded to the sub-composite. They differ by whether they are wet processable or not. In wet processable coated copper, the vias are formed by acidic or alkaline etching or the dielectric may be made etchable by photographic definition. In nonwet processable-coated copper materials, vias are formed utilizing methods such as plasma, laser drilling or mechanical drilling. The materials coated are typically epoxy, polyimide or acrylic.