SMD Assembly Capabilities for DSBGA and Other Complex Components
As a SMT Assembly Manufacturer Shenzhen, we are always working to improve our SMT assembly capabilities to better serve customers from China and overseas. The chart below outlines our current SMT assembly capabilities for some DSBGA and complex components.
For providing and maintaining the highest quality PCB assembly service for leadless component assembly, we can conduct X-ray Inspection for components such as µBGA, BGA, LGA and CSP. Other common testing services includes AOI and FCT.
| Item | SMD Assembly Capabilities | Dimension |
| Leadless Parts | Leadless parts BGA (Ball Grid Array) µBGA (Micro Ball Grid Array) CABGA (Chip Array Ball Grid Array) CTBGA (Thin Chip Array Ball Grid Array) CVBGA (Very Thin Chip Array Ball Grid Array) LGA (Land Grid Array) VFBGA (Very Fine Pitch Ball Grid Array) CSP (Chip scale Package) WLCSP (Wafer level chip scale packaging) | Pitch >= 0.3mm |
| DSBGA (Die-Size Ball Grid Array) | *Under development | |
| Flip Chip | *Under development | |
| Passive part footprints | 1005, 0201, 0402, 0603, 0805, etc. | Size >= 1005 |
For providing and maintaining the highest quality PCB assembly service for leadless component assembly, we can conduct X-ray Inspection for components such as BGA, ?BGA, LGA and CSP. Other common testing services includes AOI and FCT.
Quick Quote
Click the Quick Quote buttons below, you can turn to the different PCB quote pages. Just fill in the PCB specifications, upload Gerber files, BOM, Assembly Drawing and Pick-and-Place file, you will get quick quote of PCB board and PCB Assembly.
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